About HGCHIPS — Zhongshan Huagong Technology Co., Ltd.
Zhongshan Huagong Technology Co., Ltd. is a technology-oriented semiconductor supply company. We provide wafer-level laser ball placement, import-chip localisation (second source) and high-precision PCB cost-reduction services.
Our product line covers original-brand memory from Samsung, SK Hynix, Nanya, Micron and ADI, together with our own HGCHIPS pin-to-pin compatible replacement parts — helping customers reduce cost and shorten lead times.
Engineering and testing footprint
- Zhongshan (Guangdong) — headquarters and supply chain
- Shenzhen — test and validation centre: 100% inspection, burn-in and per-lot test reports
- Hong Kong — engineering and cross-reference comparison against original datasheets
Our 20+ person team across Zhongshan, Shenzhen and Hong Kong has served listed companies including BYD, Foxconn and ASUS — supporting wafer selection, chip verification and mass-production tracking.
What we stand for
We work on verifiable facts: a part is either pin-to-pin compatible or it is not; test data is either provided per lot or it is not. That is the basis of our second-source programme.
Contact
Zhongshan Huagong Technology Co., Ltd. (HGCHIPS)
Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
Tel: +86 760 8992 4799 Email: info@hgtech.cc
Frequently asked questions
Who is HGCHIPS?
Zhongshan Huagong Technology Co., Ltd., trading as HGCHIPS, supplies import-substitution / pin-to-pin compatible memory and power modules.
Where are you based?
Office in Zhongshan, Guangdong, China; shipment batches are 100% inspected at our Shenzhen test centre and batch test data can be provided for IQC.
How do you support quality and documentation?
100% inspection before shipment, batch test data on request, and a field-by-field spec comparison against the original part number — differences are stated rather than assumed.
How do we start?
Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799; samples from 10 pcs.
Page last updated: 2026-10-23
About Zhongshan Huagong Technology (HGCHIPS)
Zhongshan Huagong Technology Co., Ltd. is a technology company working in the semiconductor supply chain. We supply pin-to-pin compatible memory and power modules as second sources, and provide related engineering services: wafer-level laser ball bonding, import-to-domestic chip replacement, and high-precision PCB cost reduction.
What we do
- Drop-in replacement memory: DDR2 / DDR3 / DDR4 / LPDDR4·4X, cross-referenced to Samsung, SK hynix, Micron and Nanya part numbers
- Power modules: ADI µModule equivalents
- Wafer-level laser ball bonding and chip re-balling services
- PCB alternatives and volume production support (multi-layer, up to high layer counts)
- Emergency and bulk material supply for production lines
How we work
Our engineering team supports part selection, validation and production follow-up. We work with domestic microelectronics research institutes and specialists, and integrate upstream and downstream manufacturing resources so that customers can close material gaps and reduce cost without redesigning the board.
Teams in Zhongshan, Shenzhen and Hong Kong (20+ people) support customers across carrier and optical communication equipment, IT-application electronics, UAVs, power equipment, telecom devices, smart home products, new-energy vehicles and medical devices.
In-stock programme
146 part numbers are listed with stock status and reference pricing, with datasheets available online and dispatch within 48 hours for in-stock items.
Check stock & price →
在线客服
在线客服