HGCHIPS — pin-to-pin compatible memory & power modules

HGCHIPS (Zhongshan Huagong Technology Co., Ltd.) is a China-based semiconductor supply partner focused on pin-to-pin compatible memory and power modules. We engineer drop-in replacements for Samsung, SK Hynix, Micron, Nanya and Winbond DRAM as well as ADI µModule power parts — so a swap does not require a PCB redesign or a firmware change.

What we supply

  • DDR2 / DDR3 / DDR4 SDRAM — 1 Gbit to 16 Gbit, commercial and industrial grades
  • LPDDR4 / LPDDR4X
  • ADI µModule compatible power modules (LTM4600 / LTM4620 / LTM4628 / LTM4644 / LTM8052 series and more)
  • Original brand memory stock for shortage and EOL situations

Why buyers qualify us as a second source

  • Pin-to-pin / drop-in — footprint, ball map and function compared part-by-part against the original datasheet
  • Lot-level test reports — 100% inspection at our Shenzhen test center, with per-lot data for your IQC
  • Stock ships in 48h — stock lines leave Shenzhen within 48 hours; long-life programmes can be price-locked
  • 10 pcs sample MOQ — validate before releasing volume; sample cost is credited against your first order

Browse by product family

· DDR3 SDRAM replacements · DDR4 SDRAM replacements · DDR2 SDRAM replacements · ADI µModule compatible power modules · Model Finder

Contact

Zhongshan Huagong Technology Co., Ltd. (HGCHIPS)
Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
Tel: +86 760 8992 4799 Email: info@hgtech.cc

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