HGCHIPS (Zhongshan Huagong Technology Co., Ltd.) is a China-based semiconductor supply partner focused on pin-to-pin compatible memory and power modules. We engineer drop-in replacements for Samsung, SK Hynix, Micron, Nanya and Winbond DRAM as well as ADI µModule power parts — so a swap does not require a PCB redesign or a firmware change.
· DDR3 SDRAM replacements · DDR4 SDRAM replacements · DDR2 SDRAM replacements · ADI µModule compatible power modules · Model Finder
Zhongshan Huagong Technology Co., Ltd. (HGCHIPS)
Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
Tel: +86 760 8992 4799 Email: info@hgtech.cc
Import-substitution and pin-to-pin compatible parts for memory (DDR3, DDR4, LPDDR4/LPDDR4X) and ADI µModule power modules (LTM46xx / LTM80xx), used for second-sourcing, EOL cover and allocation shortages.
The compatible parts are designed as pin-to-pin drop-ins: package and pin-out are checked field by field against the original datasheet. We still recommend confirming the listed spec fields and running a small pilot batch before volume.
Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Batch test data is available for IQC.
Email info@hgtech.cc or call +86 760 8992 4799. We reply within 24 business hours (same day for stock parts).
Page last updated: 2026-09-22