ADI µModule Drop-in Replacement Cross-reference — 30 Production Parts

HGCHIPS ADI µModule pin-to-pin cross-reference: 30 production parts engineered against Samsung, SK Hynix, Micron and Nanya original part numbers. Packages BGA / BGA/LGA / LGA / LGA/BGA. Lot test reports and 48-hour dispatch on stock.

ADI µModule Full Cross-reference Table

HGCHIPS partBrandOriginal partDensityOrgSpeedVoltagePackageTemp
HG4600ADILTM4600I/LTM4600E单路输出VLGAIndustrial
HG4601ADILTM4601I/LTM4601E单路输出VBGAIndustrial
HG4602ADILTM4602I/LTM4602E单路输出VLGAIndustrial
HG4607ADILTM4607E/LTM4607I单路输出VLGA/BGAIndustrial
HG4609ADILTM4609E/LTM4609I单路输出VBGA/LGAIndustrial
HG4612ADILTM4612E/LTM4612I单路输出VLGAIndustrial
HG4613ADILTM4613E/LTM4613I单路输出VBGAIndustrial
HG4616ADILTM4616E/LTM4616I双路输出VBGAIndustrial
HG4618ADILTM4618E/LTM4618I单路输出VBGAIndustrial
HG4620ADILTM4620E/LTM4620I双路输出VBGAIndustrial
HG4622ADILTM4622E/LTM4622I双路输出VBGAIndustrial
HG4626ADILTM4626E/LTM4626I单路输出VBGAIndustrial
HG4627ADILTM4627E/LTM4627I单路输出VBGAIndustrial
HG4628PADILTM4628P双路输出VBGAIndustrial
HG4630AADILTM4630A双路输出VBGAIndustrial
HG4633ADILTM4633三路输出VBGAIndustrial
HG4638ADILTM4638单路输出VBGAIndustrial
HG4643ADILTM4643四路输出VBGAIndustrial
HG4644ADILTM4644四路输出VBGAIndustrial
HG4644TADILTM4644T四路输出VBGAIndustrial
HG4650ADILTM4650双路输出VBGAIndustrial
HG4700ADILTM4700双路输出VBGAIndustrial
HG8023ADILTM8023单路输出VBGAIndustrial
HG8025ADILTM8025单路输出VBGAIndustrial
HG8026ADILTM8026单路输出VBGAIndustrial
HG8027ADILTM8027单路输出VBGAIndustrial
HG8033ADILTM8033单路输出VBGAIndustrial
HG8052ADILTM8052单路输出VBGAIndustrial
HG8055ADILTM8055单路输出VBGAIndustrial
HG8056ADILTM8056单路输出VBGAIndustrial

Selection Notes

  • Density and organization — match organization to your memory controller.
  • Speed grade — higher grades are generally downward compatible.
  • Voltage — DDR3 1.5V, DDR3L 1.35V, DDR4 1.2V, LPDDR4/X 1.8/1.1V.
  • Temperature — commercial 0~85C, industrial -40~85C.
  • Confirmation — cross-brand replacement requires matching density, organization, speed, voltage and die; confirm with our FAE before ramp-up.

Contact: info@hgtech.cc · +86 760 8992 4799

Frequently asked questions

ADI uModule — can it drop in without board changes?

No board changes. ADI uModule is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.

How do I use the selection table?

Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.

ADI uModule — samples and lead time?

Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.

How do I request a quote for ADI uModule?

Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).

Page last updated: 2026-09-21

ADI µModule second source: what we check before we quote

We supply pin-to-pin µModule alternatives and package rework services for ADI power modules, so a supply gap or an end-of-life notice does not force a board redesign.

Five checks before a quotation is issued

  • Pin map and ball count — verified against the original datasheet, not assumed from the part family
  • Land pattern and footprint — pad geometry, pitch and keep-out area compared on the layout
  • Electrical ratings — input range, output voltage, current and switching behaviour at the application point
  • Thermal and derating — junction temperature and derating curve reviewed for the actual load
  • Package height and shielding — mechanical clearance and EMI considerations for the assembly

Module positions we currently cross-reference

  • LTM4601A, LTM4620A, LTM4622A, LTM4628, LTM4630-1, LTM4644-1, LTM4650A, LTM4650-1 and similar µModule positions
  • Related services: wafer-level laser ball bonding, chip re-balling, import-to-domestic chip replacement, high-precision PCB cost reduction

FAQ

Do you supply the complete module or the bare die?

Both. We supply complete pin-to-pin modules for board-level replacement, and we also run wafer-level laser ball bonding and re-balling for customers who rework the package themselves.

How do you demonstrate compatibility?

Three documents: a pin-to-pin mapping sheet, a per-batch test report, and a pilot-run quantity so your team can measure the part in the actual circuit before volume release.

What is the typical lead time for a module replacement?

In-stock positions dispatch within 48 hours. Made-to-order positions are typically quoted at three to four weeks from confirmed order; the exact lead time is stated in the quotation.

Can you support ADI part numbers that are not on this page?

Send the part number and quantity. We check tooling, ball count and test coverage, then confirm whether we can support it and at what minimum order quantity.

Send us your part number →
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