DDR3 SDRAM Drop-in Replacement Cross-reference — 57 Production Parts

HGCHIPS DDR3 SDRAM pin-to-pin cross-reference: 57 production parts engineered against Samsung, SK Hynix, Micron and Nanya original part numbers. Packages VFBGA-96. Lot test reports and 48-hour dispatch on stock.

DDR3 SDRAM Full Cross-reference Table

HGCHIPS partBrandOriginal partDensityOrgSpeedVoltagePackageTemp
HGD31G08S16SamsungK4B1G0846I-BCK01Gb128Mx8DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD31G08S21SamsungK4B1G0846I-BCNB1Gb128Mx8DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD31G16S16SamsungK4B1G1646I-BCK01Gb64Mx16DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD31G16S18SamsungK4B1G1646I-BCMA1Gb64Mx16DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD31G16H13SK HynixH5TQ1G63DFR-11C1Gb64Mx16DDR3-13331.5V (DDR3)VFBGA-96Commercial
HGD31G16H13ESK HynixH5TQ1G63EFR-11C1Gb64Mx16DDR3-13331.5V (DDR3)VFBGA-96Commercial
HGD31G16N13NanyaNT5CB64M16FP-DH1Gb64Mx16DDR3-13331.5V (DDR3)VFBGA-96Commercial
HGD31G16N13LNanyaNT5CC64M16GP-DI1Gb64Mx16DDR3-13331.35V (DDR3L)VFBGA-96Commercial
HGD32G16L16SamsungK4B2G1646F-BYK02Gb128Mx16DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD32G16L18SamsungK4B2G1646F-BYMA2Gb128Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD32G16L21SamsungK4B2G1646F-BCNB2Gb128Mx16DDR3-21331.35V (DDR3L)VFBGA-96Commercial
HGD32G16H18SK HynixH5TQ2G63DFR-RDC2Gb128Mx16DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD32G16L18HSK HynixH5TC2G63DFR-RDA2Gb128Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD32G16M16MicronMT41K128M16JT-1252Gb128Mx16DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD32G16N13NanyaNT5CB128M16JR-FL2Gb128Mx16DDR3-13331.5V (DDR3)VFBGA-96Commercial
HGD32G16N18NanyaNT5CC128M16JR-EK2Gb128Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD32G16N18INanyaNT5CC128M16JR-EKI2Gb128Mx16DDR3-18661.35V (DDR3L)VFBGA-96Industrial
HGD32G08L16SamsungK4B2G0846F-BYK02Gb256Mx8DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD32G08L18SamsungK4B2G0846F-BYMA2Gb256Mx8DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD32G08H18SK HynixH5TQ2G83DFR-RDC2Gb256Mx8DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD32G08L18HSK HynixH5TC2G83DFR-RDA2Gb256Mx8DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD32G08N16NanyaNT5CB256M8FN-EK2Gb256Mx8DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD34G16S16SamsungK4B4G1646D-BCK04Gb256Mx16DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD34G16S18SamsungK4B4G1646D-BCMA4Gb256Mx16DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD34G16S21SamsungK4B4G1646D-BCNB4Gb256Mx16DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD34G16S16ESamsungK4B4G1646E-BCK04Gb256Mx16DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD34G16L18ESamsungK4B4G1646E-BYMA4Gb256Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G16L21ESamsungK4B4G1646E-BYNB4Gb256Mx16DDR3-21331.35V (DDR3L)VFBGA-96Commercial
HGD34G16H18SK HynixH5TQ4G63CFR-RDC4Gb256Mx16DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD34G16L18HSK HynixH5TC4G63EFR-RDI4Gb256Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G16L18HNSK HynixH5TC4G63EFR-RDN4Gb256Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G16L21HSK HynixH5TC4G63EFR-TEN4Gb256Mx16DDR3-21331.35V (DDR3L)VFBGA-96Commercial
HGD34G16H21HSK HynixH5TQ4G63EFR-TEN4Gb256Mx16DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD34G16M16MicronMT41K256M16HA-1254Gb256Mx16DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD34G16N18NanyaNT5CC256M16ER-EK4Gb256Mx16DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G16N18INanyaNT5CC256M16ER-EKI4Gb256Mx16DDR3-18661.35V (DDR3L)VFBGA-96Industrial
HGD34G16N13NanyaNT5CB256M16ER-FL4Gb256Mx16DDR3-13331.5V (DDR3)VFBGA-96Commercial
HGD34G16N21NanyaNT5CB256M16CP4Gb256Mx16DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD34G08S16SamsungK4B4G0846D-BCK04Gb512Mx8DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD34G08S18SamsungK4B4G0846D-BCMA4Gb512Mx8DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD34G08S21SamsungK4B4G0846D-BCNB4Gb512Mx8DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD34G08S16ESamsungK4B4G0846E-BCK04Gb512Mx8DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD34G08L18ESamsungK4B4G0846E-BYMA4Gb512Mx8DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G08H18SK HynixH5TQ4G83CFR-RDC4Gb512Mx8DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD34G08L18HSK HynixH5TC4G83EFR-RDI4Gb512Mx8DDR3-18661.35V (DDR3L)VFBGA-96Commercial
HGD34G08L16HSK HynixH5TC4G83EFR-PBA4Gb512Mx8DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD34G08M16MicronMT41K512M8RH-1254Gb512Mx8DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD34G08N10NanyaNT5CC512M8EQ-FL4Gb512Mx8DDR3-10661.5V (DDR3)VFBGA-96Commercial
HGD38G04M16MicronMT41K1G4RH-1258Gb1Gx4DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD38G08S16SamsungK4B8G0846D-MCK08Gb1Gx8DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD38G08S18SamsungK4B8G0846D-MCMA8Gb1Gx8DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD38G08S21SamsungK4B8G0846D-MCNB8Gb1Gx8DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD38G08L16HSK HynixH5TC8G63CMR-PBA8Gb1Gx8DDR3-16001.35V (DDR3L)VFBGA-96Commercial
HGD38G16S16SamsungK4B8G1646D-MCK08Gb512Mx16DDR3-16001.5V (DDR3)VFBGA-96Commercial
HGD38G16S18SamsungK4B8G1646D-MCMA8Gb512Mx16DDR3-18661.5V (DDR3)VFBGA-96Commercial
HGD38G16S21SamsungK4B8G1646D-MCNB8Gb512Mx16DDR3-21331.5V (DDR3)VFBGA-96Commercial
HGD38G16M16MicronMT41K512M16HA-1258Gb512Mx16DDR3-16001.35V (DDR3L)VFBGA-96Commercial

Selection Notes

  • Density and organization — match organization to your memory controller.
  • Speed grade — higher grades are generally downward compatible.
  • Voltage — DDR3 1.5V, DDR3L 1.35V, DDR4 1.2V, LPDDR4/X 1.8/1.1V.
  • Temperature — commercial 0~85C, industrial -40~85C.
  • Confirmation — cross-brand replacement requires matching density, organization, speed, voltage and die; confirm with our FAE before ramp-up.

Contact: info@hgtech.cc · +86 760 8992 4799

Micron DDR3-1866 / DDR3-2133 Full Cross-reference (29 parts)

Compiled from the complete Micron DDR3 SDRAM part catalog (1/2/4/8Gb, x8/x16, 933MHz=1866MT/s and 1066MHz=2133MT/s): 29 part numbers including commercial, industrial IT/XIT, automotive AAT/AUT and enhanced-industrial AIT temperature grades, mapped to 11 HGCHIPS specifications. Mapping is a specification-to-specification comparison; production status must be confirmed part by part with our FAE. Parts marked "FAE review required" show Contact Sales status in the Micron catalog. Voltage convention: the Micron prefix carries the voltage — MT41K = 1.35V (DDR3L), MT41J = 1.5V (DDR3). Samsung / SK Hynix 1.35V parts include an L in the HGCHIPS part number (e.g. HGD32G16L18); the Micron family does not. Always confirm voltage in the table below.

Micron part numberDensity / OrgSpeedVoltageTemp gradeHGCHIPS partStatusPage
MT41K64M16TW-107 AAT:J1Gb / 64Mb x16DDR3-18661.35V车规级HGD31G16M18In stockStock page
MT41K64M16TW-107 AIT:J1Gb / 64Mb x16DDR3-18661.35V工业级增强HGD31G16M18FAE review requiredStock page
MT41K64M16TW-107 AUT:J1Gb / 64Mb x16DDR3-18661.35V车规级HGD31G16M18FAE review requiredStock page
MT41K64M16TW-107 IT:J1Gb / 64Mb x16DDR3-18661.35V工业级HGD31G16M18In stockStock page
MT41K64M16TW-107 XIT:J1Gb / 64Mb x16DDR3-18661.35V工业级HGD31G16M18FAE review requiredStock page
MT41K64M16TW-107:J1Gb / 64Mb x16DDR3-18661.35V商规HGD31G16M18In stockStock page
MT41K128M8DA-107 IT:J1Gb / 128Mb x8DDR3-18661.35V工业级HGD31G08M18FAE review requiredStock page
MT41K128M8DA-107:J1Gb / 128Mb x8DDR3-18661.35V商规HGD31G08M18FAE review requiredStock page
MT41K128M16JT-107 AAT:K2Gb / 128Mb x16DDR3-18661.35V车规级HGD32G16M18In stockStock page
MT41K128M16JT-107 IT:K2Gb / 128Mb x16DDR3-18661.35V工业级HGD32G16M18FAE review requiredStock page
MT41K128M16JT-107:K2Gb / 128Mb x16DDR3-18661.35V商规HGD32G16M18In stockStock page
MT41J128M16JT-093:K2Gb / 128Mb x16DDR3-21331.5V商规HGD32G16M21FAE review requiredStock page
MT41K256M8DA-107 AAT:K2Gb / 256Mb x8DDR3-18661.35V车规级HGD32G08M18FAE review requiredStock page
MT41K256M8DA-107:K2Gb / 256Mb x8DDR3-18661.35V商规HGD32G08M18FAE review requiredStock page
MT41K256M16TW-107 AAT:P4Gb / 256Mb x16DDR3-18661.35V车规级HGD34G16M18In stockStock page
MT41K256M16TW-107 AIT:P4Gb / 256Mb x16DDR3-18661.35V工业级增强HGD34G16M18In stockStock page
MT41K256M16TW-107 AUT:P4Gb / 256Mb x16DDR3-18661.35V车规级HGD34G16M18FAE review requiredStock page
MT41K256M16TW-107 IT:P4Gb / 256Mb x16DDR3-18661.35V工业级HGD34G16M18In stockStock page
MT41K256M16TW-107 XIT:P4Gb / 256Mb x16DDR3-18661.35V工业级HGD34G16M18In stockStock page
MT41K256M16TW-107:P4Gb / 256Mb x16DDR3-18661.35V商规HGD34G16M18In stockStock page
MT41K256M16TW-093:P4Gb / 256Mb x16DDR3-21331.35V商规HGD34G16M21In stockStock page
MT41K512M8DA-107 AAT:P4Gb / 512Mb x8DDR3-18661.35V车规级HGD34G08M18FAE review requiredStock page
MT41K512M8DA-107 IT:P4Gb / 512Mb x8DDR3-18661.35V工业级HGD34G08M18In stockStock page
MT41K512M8DA-107:P4Gb / 512Mb x8DDR3-18661.35V商规HGD34G08M18In stockStock page
MT41K512M8DA-093:P4Gb / 512Mb x8DDR3-21331.35V商规HGD34G08M21In stockStock page
MT41K512M16VRP-107 AAT:P8Gb / 512Mb x16DDR3-18661.35V车规级HGD38G16M18FAE review requiredStock page
MT41K512M16VRP-107 AIT:P8Gb / 512Mb x16DDR3-18661.35V工业级增强HGD38G16M18FAE review requiredStock page
MT41K512M16VRP-107 IT:P8Gb / 512Mb x16DDR3-18661.35V工业级HGD38G16M18In stockStock page
MT41K1G8RKB-107:P8Gb / 1Gb x8DDR3-18661.35V商规HGD38G08M18FAE review requiredStock page

Ramp-up notes

  • Lock the mapping on density + organization + speed + voltage first; only step up the temperature grade when the platform truly requires it (automotive and industrial grades carry a clear price premium).
  • 1866MT/s (933MHz) is downward compatible with 1600MT/s platforms, and 2133MT/s (1066MHz) likewise; confirm platform speed in the controller datasheet.
  • Cross-check pin-out and register maps with our FAE and complete small-batch validation before ramp-up.

Frequently asked questions

DDR3 SDRAM — can it drop in without board changes?

No board changes. DDR3 SDRAM is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.

How do I use the selection table?

Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.

DDR3 SDRAM — samples and lead time?

Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.

How do I request a quote for DDR3 SDRAM?

Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).

Page last updated: 2026-09-21

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