K4B4G0846E-BYMA Drop-in Replacement — HGCHIPS HGD34G08L18E

Sourcing an alternative to K4B4G0846E-BYMA (Samsung)? HGCHIPS HGD34G08L18E is a pin-to-pin compatible part: package, pin-out and function cross-checked against the original datasheet, so it drops into your existing PCB and firmware with no circuit change.

K4B4G0846E-BYMA Specifications

BrandSamsung
Original part numberK4B4G0846E-BYMA
Product familyDDR3 SDRAM
Density4Gb
Organization512Mx8
Speed gradeDDR3-1866
Voltage1.35V (DDR3L)
PackageVFBGA-96
TemperatureCommercial 0~85C

Cross-reference: K4B4G0846E-BYMA → HGD34G08L18E

ItemSamsung (original)HGD34G08L18E (HGCHIPS)
Product familyDDR3 SDRAMDDR3 SDRAM
Density4Gb4Gb
Organization512Mx8512Mx8
Speed gradeDDR3-1866DDR3-1866
Voltage1.35V (DDR3L)1.35V (DDR3L)
PackageVFBGA-96VFBGA-96
Temperature商规商规
CompatibilityOriginalpin-to-pin

Replacement Notes

  • No circuit change — identical package and pin-out, replace directly in the BOM for pilot run.
  • Lot test reports — 100% tested before shipment, test data available per lot for IQC records.
  • Speed and voltage grades — a higher speed grade is downward compatible; commercial grade does not replace industrial grade, pick -40~85C parts for industrial and outdoor designs.
  • Qualification advice — send the full part number (with suffix) and platform details so our FAE team can confirm die revision and timing before volume production.

Ordering and Samples

  • In stock, ships within 48 hours; price lock available for long-term projects.
  • Samples from 10 pcs, cost credited against your first order.
  • Small pilot runs and volume production supported with lot traceability.

Related Replacements

Same family: H5TC2G63DFR-RDA / H5TC2G83DFR-RDA / H5TC4G63EFR-RDI / H5TC4G63EFR-RDN / H5TC4G63EFR-TEN / H5TC4G83EFR-PBA / H5TC4G83EFR-RDI / H5TC8G63CMR-PBA

HGCHIPS HGD34G08L18E part page · Model Finder · Contact: info@hgtech.cc · +86 760 8992 4799

粤ICP备2022148569号
在线客服
在线客服