DDR4 SDRAM Drop-in Replacement Cross-reference — 30 Production Parts

HGCHIPS DDR4 SDRAM pin-to-pin cross-reference: 30 production parts engineered against Samsung, SK Hynix, Micron and Nanya original part numbers. Packages FBGA-78/96. Lot test reports and 48-hour dispatch on stock.

DDR4 SDRAM Full Cross-reference Table

Selection Notes

• Density and organization — match organization to your memory controller.
• Speed grade — higher grades are generally downward compatible.
• Voltage — DDR3 1.5V, DDR3L 1.35V, DDR4 1.2V, LPDDR4/X 1.8/1.1V.
• Temperature — commercial 0~85C, industrial -40~85C.
• Confirmation — cross-brand replacement requires matching density, organization, speed, voltage and die; confirm with our FAE before ramp-up.

Contact: info@hgtech.cc · +86 760 8992 4799

Frequently asked questions

DDR4 SDRAM — can it drop in without board changes?

No board changes. DDR4 SDRAM is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.

How do I use the selection table?

Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.

DDR4 SDRAM — samples and lead time?

Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.

How do I request a quote for DDR4 SDRAM?

Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).