K4ABG165WA-BIWE Drop-in Replacement — HGCHIPS HGD4BG16S26

Sourcing an alternative to K4ABG165WA-BIWE (Samsung)? HGCHIPS HGD4BG16S26 is a pin-to-pin compatible part: package, pin-out and function cross-checked against the original datasheet, so it drops into your existing PCB and firmware with no circuit change.

K4ABG165WA-BIWE Specifications

BrandSamsung
Original part numberK4ABG165WA-BIWE
Product familyDDR4 SDRAM
Density32Gb
Organization2Gx16
Speed gradeDDR4-2666
Voltage1.2V (DDR4)
PackageFBGA-78/96
TemperatureCommercial 0~85C

Cross-reference: K4ABG165WA-BIWE → HGD4BG16S26

ItemSamsung (original)HGD4BG16S26 (HGCHIPS)
Product familyDDR4 SDRAMDDR4 SDRAM
Density32Gb32Gb
Organization2Gx162Gx16
Speed gradeDDR4-2666DDR4-2666
Voltage1.2V (DDR4)1.2V (DDR4)
PackageFBGA-78/96FBGA-78/96
Temperature商规商规
CompatibilityOriginalpin-to-pin

Replacement Notes

  • No circuit change — identical package and pin-out, replace directly in the BOM for pilot run.
  • Lot test reports — 100% tested before shipment, test data available per lot for IQC records.
  • Speed and voltage grades — a higher speed grade is downward compatible; commercial grade does not replace industrial grade, pick -40~85C parts for industrial and outdoor designs.
  • Qualification advice — send the full part number (with suffix) and platform details so our FAE team can confirm die revision and timing before volume production.

Ordering and Samples

  • In stock, ships within 48 hours; price lock available for long-term projects.
  • Samples from 10 pcs, cost credited against your first order.
  • Small pilot runs and volume production supported with lot traceability.

Related Replacements

Same family: H5AN8G6NCJR-VKC / H5AN8G6NCJR-WMC / H5AN8G6NCJR-XNC / H5AN8G6NDJR-XNC / H5AN8G8NCJR-VKC / H5AN8G8NCJR-WMC / H5AN8G8NCJR-XNC / H5AN8G8NDJR-XNC

HGCHIPS HGD4BG16S26 part page · Model Finder · Contact: info@hgtech.cc · +86 760 8992 4799

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