LPDDR4 / LPDDR4X Drop-in Replacement Cross-reference — 39 Production Parts

HGCHIPS LPDDR4 / LPDDR4X pin-to-pin cross-reference table: 39 production parts engineered against Samsung, SK Hynix, Micron and Nanya original part numbers. Packages VFBGA-200. Lot test reports and 48-hour dispatch on stock.

LPDDR4 / LPDDR4X Full Cross-reference Table

HGCHIPS partBrandOriginal partDensityOrgSpeedVoltagePackageTemp
HGD4F04S42SamsungK4F4E164HF-KFCL4Gbx16LPDDR4-42661.8/1.1/1.1VVFBGA-200Commercial
HGD4F04S42HSamsungK4F4E164HF-KHCL4Gbx16LPDDR4-42661.8/1.1/1.1VVFBGA-200Commercial
HGD4M04S21MicronMT53E256M16D1FW-0464Gbx16LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M04S18MicronMT53B128M32D1DT-0534Gbx32LPDDR4-18661.8/1.1/1.1VVFBGA-200Commercial
HGD4N04S16NanyaNT6CL128M32CM-H14Gbx32LPDDR4-16001.8/1.2/1.2VVFBGA-200Commercial
HGD4M08S21MicronMT53D512M16D1DS-0468Gbx16LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4F08X42SamsungK4F8E304HB-MGCH8Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4H01S37SK HynixH9HCNNN8KUMLHR-NME8Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4H01S32SK HynixH9HCNNN8KUMLHR-NLE8Gbx32LPDDR4-32001.8/1.1/1.1VVFBGA-200Commercial
HGD4N08S37NanyaNT6AP256T32AV-J28Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4N08S16NanyaNT6CL256T32CM-H18Gbx32LPDDR4-16001.8/1.2/1.2VVFBGA-200Commercial
HGD4M16S21ZMicronMT53E1G16D1ZW-04616Gbx16LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4F16S37SamsungK4F6E3S4HM-GFCL16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4F16S37TSamsungK4F6E3S4HM-TFCL16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4F16S37HSamsungK4F6E3S4HM-THCL16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4F16S37DSamsungK4F6E3D4HB-MFCJ16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4F16S37MSamsungK4F6E3D4HB-MHCJ16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4H02S37SK HynixH9HCNNNBPUMLHR-NME16Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4H02S32SK HynixH9HCNNNBPUMLHR-NLE16Gbx32LPDDR4-32001.8/1.1/1.1VVFBGA-200Commercial
HGD4M16S21MicronMT53D512M32D2DS-04616Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M16S21EMicronMT53E512M32D2DS-04616Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M24S21MicronMT53E768M32D2ZW-04624Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4F32S37SamsungK4FBE3D4HM-THCL32Gbx32LPDDR4-37331.8/1.1/1.1VVFBGA-200Commercial
HGD4H04S42SK HynixH54G56BYYVX04632Gbx32LPDDR4-42661.8/1.1/1.1VVFBGA-200Commercial
HGD4H04S42QSK HynixH54G56BYYQX04632Gbx32LPDDR4-42661.8/1.1/1.1VVFBGA-200Commercial
HGD4H04X42SK HynixH9HKNNNCRMAVAR-NEH32Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4M32S21FMicronMT53E1G32D2FW-04632Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M32S21MicronMT53E512M64D2HJ-04632Gbx64LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4H08X42SK HynixH54G66BYYJX10464Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4H08X42NSK HynixH9HCNNNFBMMVAR-NEH64Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4H08X42BSK HynixH9HCNNNFBMBLPR-NEE64Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4H08X42FSK HynixH9HCNNNFAMMLXR-NEE64Gbx32LPDDR4X-42661.8/1.1/0.6VVFBGA-200Commercial
HGD4H08X37SK HynixH9HCNNNFAMALTR-NME64Gbx32LPDDR4X-37331.8/1.1/0.6VVFBGA-200Commercial
HGD4H08X37FSK HynixH9HCNNNFAMALTR-NME64Gbx32LPDDR4X-37331.8/1.1/0.6VVFBGA-200Commercial
HGD4M64S21MicronMT53E2G32D4DT-04664Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M64S21HMicronMT53E1G64D4HJ-04664Gbx64LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M64S21NMicronMT53D1G64D4NW-04664Gbx64LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M128S21MicronMT53E4G32D8GS-046128Gbx32LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial
HGD4M128S21TMicronMT53E2G64D8TN-046128Gbx64LPDDR4-21331.8/1.1/1.1VVFBGA-200Commercial

Selection Notes

  • Density and organization — match organization (64Mx16, 128Mx16, 256Mx16, 512Mx8, x32 ...) to your controller.
  • Speed grade — higher grades are generally downward compatible; select against the actual system clock.
  • Voltage — DDR3 1.5V, DDR3L 1.35V, DDR4 1.2V, LPDDR4/X 1.8/1.1V.
  • Temperature — commercial 0~85C vs industrial -40~85C; choose industrial for harsh environments.
  • Confirmation — cross-brand replacement requires matching density, organization, speed, voltage and die; lock the full part number and confirm with our FAE before ramp-up.

Contact: info@hgtech.cc · +86 760 8992 4799

Frequently asked questions

LPDDR4 LPDDR4X — can it drop in without board changes?

No board changes. LPDDR4 LPDDR4X is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.

How do I use the selection table?

Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.

LPDDR4 LPDDR4X — samples and lead time?

Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.

How do I request a quote for LPDDR4 LPDDR4X?

Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).

Page last updated: 2026-09-21

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