HGCHIPS HGD31G08M18 Replacement Cross-reference — 1Gb 128Mb x8 DDR3-1866

HGCHIPS HGD31G08M18 is a spec-matched option for the Micron DDR3L family: density 1Gb, organization 128Mb x8, speed grade DDR3-1866, voltage 1.35V (DDR3L) and package FBGA, aligned item by item against the original datasheet.

Status: in production and available (spec-matched). Production status has been confirmed by our FAE, so quotation and scheduling are available now. This page claims specification matching only (density / organization / speed / voltage) — no pin-to-pin compatibility. For a pin-level conclusion, send us the complete part number and platform details and our FAE will confirm pin-out and die revision in writing.

HGD31G08M18 Key specifications

HGCHIPS partHGD31G08M18
Product familyDDR3 SDRAM
Density1Gb
Organization128Mb x8
Speed gradeDDR3-1866
Voltage1.35V (DDR3L)
PackageFBGA 78-ball
Temp grade-40°C to +95°C; 0°C to +95°C
Original partsMicron (2 part numbers)
Production statusIn production and available (FAE confirmed)
CompatibilitySpec-matched (density/org/speed/voltage); ask our FAE for a pin-level conclusion

Micron original parts covered (2)

Original partDensity / OrgSpeedVoltageTemp gradeOriginal status
MT41K128M8DA-107 IT:J1Gb 128Mb x8DDR3-18661.35V (DDR3L)工业级End of Life
MT41K128M8DA-107:J1Gb 128Mb x8DDR3-18661.35V (DDR3L)商规End of Life

Before you design it in

  • This part is in production and available, offered as a spec-matched option; ask our FAE for a pin-level conclusion before ramp-up.
  • Speed grades step down: the 1866 MT/s grade covers 1600 MT/s and slower platforms — check the controller datasheet for the actual frequency.
  • Commercial and industrial grades carry a clear price premium; step up the temperature grade only when the platform truly requires it.
  • Validate in small quantities first — samples from 10 pcs, credited against your first order.

Related pages

DDR3 SDRAM cross-reference table · Model finder: look up the original part number

Frequently asked questions

HGD31G08M18 — can it drop in without board changes?

No board changes. HGD31G08M18 is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.

How do I use the selection table?

Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.

HGD31G08M18 — samples and lead time?

Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.

How do I request a quote for HGD31G08M18?

Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).

Page last updated: 2026-09-21

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