HGCHIPS HGD32G08M18 Replacement Cross-reference — 2Gb 256Mb x8 DDR3-1866
HGCHIPS HGD32G08M18 is a spec-matched option for the Micron DDR3L family: density 2Gb, organization 256Mb x8, speed grade DDR3-1866, voltage 1.35V (DDR3L) and package FBGA, aligned item by item against the original datasheet.
Status: in production and available (spec-matched). Production status has been confirmed by our FAE, so quotation and scheduling are available now. This page claims specification matching only (density / organization / speed / voltage) — no pin-to-pin compatibility. For a pin-level conclusion, send us the complete part number and platform details and our FAE will confirm pin-out and die revision in writing.
HGD32G08M18 Key specifications
| HGCHIPS part | HGD32G08M18 |
|---|---|
| Product family | DDR3 SDRAM |
| Density | 2Gb |
| Organization | 256Mb x8 |
| Speed grade | DDR3-1866 |
| Voltage | 1.35V (DDR3L) |
| Package | FBGA 78-ball |
| Temp grade | -40°C to +105°C; 0°C to +95°C |
| Original parts | Micron (2 part numbers) |
| Production status | In production and available (FAE confirmed) |
| Compatibility | Spec-matched (density/org/speed/voltage); ask our FAE for a pin-level conclusion |
Micron original parts covered (2)
| Original part | Density / Org | Speed | Voltage | Temp grade | Original status |
|---|---|---|---|---|---|
| MT41K256M8DA-107 AAT:K | 2Gb 256Mb x8 | DDR3-1866 | 1.35V (DDR3L) | 车规级 | End of Life |
| MT41K256M8DA-107:K | 2Gb 256Mb x8 | DDR3-1866 | 1.35V (DDR3L) | 商规 | End of Life |
Before you design it in
- This part is in production and available, offered as a spec-matched option; ask our FAE for a pin-level conclusion before ramp-up.
- Speed grades step down: the 1866 MT/s grade covers 1600 MT/s and slower platforms — check the controller datasheet for the actual frequency.
- Commercial and industrial grades carry a clear price premium; step up the temperature grade only when the platform truly requires it.
- Validate in small quantities first — samples from 10 pcs, credited against your first order.
Related pages
DDR3 SDRAM cross-reference table · Model finder: look up the original part number
Frequently asked questions
HGD32G08M18 — can it drop in without board changes?
No board changes. HGD32G08M18 is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.
How do I use the selection table?
Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.
HGD32G08M18 — samples and lead time?
Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.
How do I request a quote for HGD32G08M18?
Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).
Page last updated: 2026-09-21
Related pages for HGD32G08M18
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