HGD4AG16S32 — DDR4 SDRAM drop-in replacement for K4AAG165WB-BCWE
HGCHIPS HGD4AG16S32 is engineered as a pin-to-pin replacement for K4AAG165WB-BCWE (Samsung). Package outline and ball map are verified against the original datasheet, so the part can be swapped on existing PCBs without layout changes — suited to second-source qualification, EOL (end-of-life) and allocation shortage situations. Full specification on the HGD4AG16S32 part page, cross reference on the K4AAG165WB-BCWE page.
Key features
- Pin-to-pin compatible with K4AAG165WB-BCWE: ball map and package verified item by item.
- In production: per-lot test reports shipped with every batch for qualification records.
- Stock ships in 48 hours: safety stock on popular parts, samples from 10 pcs (credited to first order).
- Selection support: cross-reference sheets, samples and qualification advice available on request.
Specifications
| HGCHIPS part number | HGD4AG16S32 |
|---|
| Product family | DDR4 SDRAM |
|---|
| Cross reference | K4AAG165WB-BCWE |
|---|
| Original manufacturer | Samsung |
|---|
Cross reference
Drop-in for K4AAG165WB-BCWE (Samsung). Check any part number in the model finder.
Typical applications
Servers, industrial motherboards, switches, storage and surveillance equipment.
Supply & contact
Samples and volume: tel +86 760 8992 4799, email info@hgtech.cc. More parts: DDR4 SDRAM cross reference · DDR memory overview · in-stock programme.
在线客服
在线客服