HGCHIPS covers 146 DDR-family part numbers (DDR3 71 / DDR4 35 / LPDDR4·4X 39 / DDR2 1) as pin-to-pin replacements for Samsung, SK hynix, Micron, Nanya and Winbond memory. 137 are in volume production; 9 further parts are spec-matched (production status to be confirmed in writing by our FAE). Package and ball map are verified against the original datasheet, so no PCB change is required — suited to second-source qualification, EOL and allocation cases.
| HGCHIPS part | Brand | Original part number | Specification |
|---|---|---|---|
| HGD34G16S18 | Samsung | K4B4G1646E-BCMA | 4Gb 256Mx16 DDR3-1866 |
| HGD34G16S21 | Samsung | K4B4G1646E-BCNB | 4Gb 256Mx16 DDR3-2133 |
| HGD32G16S21 | Samsung | K4B2G1646F-BCNB | |
| HGD44G16H18 | SK hynix | H5TC4G63EFR-RDA | |
| HGD34G16N18 | Nanya | NT5CC256M16ER-EK | 4Gb 256Mx16 DDR3-1866 |
| HGD32G16N16 | Nanya | NT5CC128M16IP-DI | |
| HGD31G08S16 | Samsung | K4B1G0846I-BCK0 | 1Gb 128Mx8 DDR3-1600 |
| HGD31G08S21 | Samsung | K4B1G0846I-BCNB | 1Gb 128Mx8 DDR3-2133 |
| HGD31G16S16 | Samsung | K4B1G1646I-BCK0 | 1Gb 64Mx16 DDR3-1600 |
| HGD31G16S18 | Samsung | K4B1G1646I-BCMA | 1Gb 64Mx16 DDR3-1866 |
Full list of 71: DDR3 SDRAM cross reference.
| HGCHIPS part | Brand | Original part number | Specification |
|---|---|---|---|
| HGD44G16S26 | Samsung | K4A4G165WF-BCTD | |
| HGD44G16S32 | Samsung | K4A4G165WF-BCWE | |
| HGD4AG16S32 | Samsung | K4AAG165WB-BCWE | |
| HGD48G16S32 | Samsung | K4A8G165WB-BCWE | |
| HGD48G16H32 | SK hynix | H5AN8G6NCJR-XNC | 8Gb 512Mx16 DDR4-3200 |
| HGD4AG16H32 | SK hynix | H5ANAG6NCJR-XNC | 16Gb 1Gx16 DDR4-3200 |
| HGD44G16N26 | Nanya | NT5AD256M16D4-HR | |
| HGD48G16N26 | Nanya | NT5AD512M16C4-HR | 8Gb 512Mx16 DDR4-2666 |
| HGD48G08S26 | Samsung | K4A8G085WC-BCTD | 8Gb 1Gx8 DDR4-2666 |
| HGD48G16S26 | Samsung | K4A8G165WC-BCTD | 8Gb 512Mx16 DDR4-2666 |
Full list of 35: DDR4 SDRAM cross reference.
| HGCHIPS part | Brand | Original part number | Specification |
|---|---|---|---|
| HGD4F16S37 | Samsung | K4F6E3S4HM-GFCL | 16Gb x32 LPDDR4-3733 |
| HGD4F16S37T | Samsung | K4F6E3S4HM-TFCL | 16Gb x32 LPDDR4-3733 |
| HGD4F16S37H | Samsung | K4F6E3S4HM-THCL | 16Gb x32 LPDDR4-3733 |
| HGD4F16S37D | Samsung | K4F6E3D4HB-MFCJ | 16Gb x32 LPDDR4-3733 |
| HGD4F16S37M | Samsung | K4F6E3D4HB-MHCJ | 16Gb x32 LPDDR4-3733 |
| HGD4F08X42 | Samsung | K4F8E304HB-MGCH | 8Gb x32 LPDDR4X-4266 |
| HGD4F32S37 | Samsung | K4FBE3D4HM-THCL | 32Gb x32 LPDDR4-3733 |
| HGD4F04S42 | Samsung | K4F4E164HF-KFCL | 4Gb x16 LPDDR4-4266 |
| HGD4F04S42H | Samsung | K4F4E164HF-KHCL | 4Gb x16 LPDDR4-4266 |
| HGD4H04S42 | SK hynix | H54G56BYYVX046 | 32Gb x32 LPDDR4-4266 |
Full list of 39: LPDDR4/4X cross reference.
| HGCHIPS part | Brand | Original part number | Specification |
|---|---|---|---|
| HGD201G16W08 | Winbond | W971GG6NB-25 |
Full list of 1: DDR2 SDRAM cross reference.
Popular parts are held in stock and ship within 48 hours; samples from 10 pcs (credited to the first order). Tel +86 760 8992 4799 · email info@hgtech.cc.
Related: DDR3 cross reference · DDR4 cross reference · LPDDR4/4X cross reference · ADI µModule replacements · in-stock programme · model finder
No board changes. DDR Memory is designed as a pin-to-pin drop-in: package and pin-out are checked field by field against the original datasheet, so it fits the existing PCB and firmware. Typical use is second-sourcing, EOL cover and allocation shortages.
Find your original part number, then check density, organization, speed grade, voltage, package and temperature range against your BOM. Any field that differs is stated on the page — we do not claim the parts are identical.
Samples from 10 pcs, credited against the first order. In-stock items ship from Shenzhen within 48 hours; long-lead projects can be price-locked. Parts are 100% inspected before shipment and batch test data is available for IQC.
Send your target part number, monthly usage and target price to info@hgtech.cc or call +86 760 8992 4799 — we reply within 24 business hours (same day for stock parts).
Page last updated: 2026-09-21