HGD4F32S37 — LPDDR4/4X drop-in replacement for K4FBE3D4HM-THCL
HGCHIPS HGD4F32S37 is engineered as a pin-to-pin replacement for K4FBE3D4HM-THCL (Samsung). Package outline and ball map are verified against the original datasheet, so the part can be swapped on existing PCBs without layout changes — suited to second-source qualification, EOL (end-of-life) and allocation shortage situations. Full specification on the HGD4F32S37 part page, cross reference on the K4FBE3D4HM-THCL page.
Key features
- Pin-to-pin compatible with K4FBE3D4HM-THCL: ball map and package verified item by item.
- In production: per-lot test reports shipped with every batch for qualification records.
- Stock ships in 48 hours: safety stock on popular parts, samples from 10 pcs (credited to first order).
- Selection support: cross-reference sheets, samples and qualification advice available on request.
Specifications
| HGCHIPS part number | HGD4F32S37 |
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| Product family | LPDDR4/4X |
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| Density / organisation | 32Gb x32 |
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| Speed grade | LPDDR4-3733 |
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| Voltage | 1.8/1.1/1.1V |
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| Package | VFBGA-200 |
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| Temperature grade | 商规 |
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| Cross reference | K4FBE3D4HM-THCL · K4FBE3D4HM-MGCL |
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| Original manufacturer | Samsung |
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Cross reference
Drop-in for K4FBE3D4HM-THCL (Samsung); same-spec alternatives: K4FBE3D4HM-MGCL. Check any part number in the model finder.
Typical applications
Smartphones, tablets, automotive cockpit / IVI, AI edge modules.
Supply & contact
Samples and volume: tel +86 760 8992 4799, email info@hgtech.cc. More parts: LPDDR4/4X cross reference · DDR memory overview · in-stock programme.
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