HGD4AG16S26 — DDR4 SDRAM drop-in replacement for K4AAG165WA-BIWE
HGCHIPS HGD4AG16S26 is engineered as a pin-to-pin replacement for K4AAG165WA-BIWE (Samsung). Package outline and ball map are verified against the original datasheet, so the part can be swapped on existing PCBs without layout changes — suited to second-source qualification, EOL (end-of-life) and allocation shortage situations. Full specification on the HGD4AG16S26 part page, cross reference on the K4AAG165WA-BIWE page.
Key features
- Pin-to-pin compatible with K4AAG165WA-BIWE: ball map and package verified item by item.
- In production: per-lot test reports shipped with every batch for qualification records.
- Stock ships in 48 hours: safety stock on popular parts, samples from 10 pcs (credited to first order).
- Selection support: cross-reference sheets, samples and qualification advice available on request.
Specifications
| HGCHIPS part number | HGD4AG16S26 |
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| Product family | DDR4 SDRAM |
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| Density / organisation | 16Gb 1Gx16 |
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| Speed grade | DDR4-2666 |
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| Voltage | 1.2V |
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| Package | FBGA-78/96 |
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| Temperature grade | 商规 |
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| Cross reference | K4AAG165WA-BIWE · K4AAG165WB-MCRC |
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| Original manufacturer | Samsung |
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Cross reference
Drop-in for K4AAG165WA-BIWE (Samsung); same-spec alternatives: K4AAG165WB-MCRC. Check any part number in the model finder.
Typical applications
Servers, industrial motherboards, switches, storage and surveillance equipment.
Supply & contact
Samples and volume: tel +86 760 8992 4799, email info@hgtech.cc. More parts: DDR4 SDRAM cross reference · DDR memory overview · in-stock programme.
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