HGD32G16L18 — DDR3 SDRAM drop-in replacement for K4B2G1646F-BYMA
HGCHIPS HGD32G16L18 is engineered as a pin-to-pin replacement for K4B2G1646F-BYMA (Samsung). Package outline and ball map are verified against the original datasheet, so the part can be swapped on existing PCBs without layout changes — suited to second-source qualification, EOL (end-of-life) and allocation shortage situations. Full specification on the HGD32G16L18 part page, cross reference on the K4B2G1646F-BYMA page.
Key features
- Pin-to-pin compatible with K4B2G1646F-BYMA: ball map and package verified item by item.
- In production: per-lot test reports shipped with every batch for qualification records.
- Stock ships in 48 hours: safety stock on popular parts, samples from 10 pcs (credited to first order).
- Selection support: cross-reference sheets, samples and qualification advice available on request.
Specifications
| HGCHIPS part number | HGD32G16L18 |
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| Product family | DDR3 SDRAM |
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| Density / organisation | 2Gb 128Mx16 |
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| Speed grade | DDR3-1866 |
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| Voltage | 1.35V |
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| Package | VFBGA-96 |
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| Temperature grade | 商规 |
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| Cross reference | K4B2G1646F-BYMA |
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| Original manufacturer | Samsung |
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Cross reference
Drop-in for K4B2G1646F-BYMA (Samsung). Check any part number in the model finder.
Typical applications
Routers, GPON/ONT, set-top boxes, industrial control boards, digital signage and CCTV systems.
Supply & contact
Samples and volume: tel +86 760 8992 4799, email info@hgtech.cc. More parts: DDR3 SDRAM cross reference · DDR memory overview · in-stock programme.
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